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Bump Height Measurement凸起高度測(cè)量
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Ultra Fast Measurements (UF 800)超快速測(cè)量
? Acquisition time of 125 μs accomplished with High Speed reference mirror and optical encoder
??? 高速參考反射鏡和光編碼器使設(shè)備僅需125 μs采集時(shí)間
??? Ideal? solution for measurement on spinning wafers旋轉(zhuǎn)硅片測(cè)量的理想方法
??? Pressurized? enclosure for measurement in challenging environments高壓密閉檢測(cè)
??? Software? and hardware interface for customizitation/OEM按客戶(hù)需求訂制軟件和硬件界面
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413 Optical EchoProbe光學(xué)反射探針
Overview about Configurations結(jié)構(gòu)綜述
413EC (Manual System手動(dòng)系統(tǒng))
413-200 (Semiautomated system –motorized, x-y stage for mapping
半自動(dòng)系統(tǒng)，兩向映像)
413-300 (Semiautomated system – motorized, x-y stage for mapping
半自動(dòng)系統(tǒng)，兩向映像)
413-C2C (Fully automated with Robotic Handler, 200mm or 300mm
機(jī)械手硅片抓取全自動(dòng)系統(tǒng)，200mm或者300mm)
Wafer-UF800 (UltraFast Optical EchoProbe for spinning wafers
旋轉(zhuǎn)硅片超快速光學(xué)反射探針)
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Manual System 413EC手動(dòng)系統(tǒng)
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Manual System 413EC手動(dòng)系統(tǒng)
Single Probe and Roughness-Option單探針，粗糙度檢測(cè)可選
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Semi-Automated EchoProbe半自動(dòng)反射探針
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Fully-Automated EchoProbe 全自動(dòng)反射探針
Fullyautomated wafer handling (bare wafer, wafer with tape or Flexframes -Cassettes or Thin Wafer Pods)
全自動(dòng)硅片處理（裸片，膠帶硅片或靈活結(jié)構(gòu)花籃，或者薄硅片）
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